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With the development of microelectronics, computer technology, information technology, and intelligent of machinery and control equipment, the flexible manufacturing technique has become one of the key developing directions for advanced manufacturing technology. The cloud manufacturing (CMfg), which is a new generation service-oriented networked manufacturing model, can provide the users distributed...
Major efforts are currently underway throughout the IC industry to develop the capability to integrate device chips by stacking them vertically and using through-silicon vias (TSVs). The resulting interconnect density, bandwidth, and compactness achievable by TSV technology exceed what is currently possible by other packaging approaches. Market-driven applications of TSV involving memory include multi-chip...
High-performance poly-Si thin-film transistors (TFTs) using an ultrathin high- κ metal gate stack with a subthreshold swing (SS) of 193 mV/dec when operating at room temperature and maximum thermal budget of 700°C are readily compatible with monolithic 3-D integrated circuits (3D-ICs) and silicon-on-glass (SOG) applications. The SS is reduced to 31 mV/dec, and the on/off current ratio is increased...
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