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Early formation of Cu6Sn5 and (Ni,Cu)6Sn5 during soldering was investigated. Sn4.0Ag0.5Cu solder on Cu and electroless Ni-Au substrate was quenched in ice water after the initial stage of melting, and the solder–substrate interface was analyzed by transmission electron microscopy and energy-dispersive x-ray spectroscopy. At the contacting point, Cu3Sn and Cu6Sn5 were found at the solder–Cu substrate...
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