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In this work, a study of TSVs electrodeposition filling by the periodic pulse reverse current was performed in a plate solution without additives. A void-free filling was obtained at a lower current density while a hollow or seam structures were obtained at a higher current density. A “bottom-up” growth mode could be realized at the lower current density. The current distribution uniformity inside...
We demonstrate flexible and highly sensitive capacitive sensor arrays that encapsulate DI water as dielectric. DI water, which is a ferroelectric liquid and has a relative dielectric constant of approximately 80, could increase the capacitance of the sensor and enhance the sensitivity while maintaining flexibility of the sensor with electrodes patterned on flexible PDMS substrates. The proposed sensor...
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