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In order to achieve more functions in certain size of the chip, and avoid RC delay caused by long-range interconnect under high density 2D encapsulation at the same time, the researchers focused on the Z direction — 3D packaging. With the increase of storage capacity, and the large scale of data logic fever problems will more and more obvious. So it will not be able to an unlimited number of laminated...
A new type of breakout prediction system based on multilevel neural network for continuous casting was proposed, which consists of a pattern recognition unit of single-thermocouple temperature pattern based on BP neural network, a logic judgment unit of multi-thermocouple temperature pattern and a decision making unit of fuzzy neural network based on T-S (Takagi-Sugeno) model. In the training of BP...
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