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Impact behaviors of high-power LED are essential due to the possible poor adhesion of interfaces and should be studied. In this study, the analysis of dynamic response for high-power LED module under impact load is conducted with simplified theoretical analysis, experimental testing and numerical simulation. A self-made microelectronics drop impact tester is established. Then reliability performances...
As the market is desperate for better performed, miniaturized, highreliableand lower-priced electronic devices, nowadays, three dimensional integrated circuit (3D IC) seems to be a promising technology which can meet these requirements. However, many issues hinder this technology from being developedrapidly, among which the reliability of through silicon via(TSV) is one of the major concerns. Because...
As the most promising candidate for the realization of high-efficiency light sources for general lighting, the high power lighting emitting diodes (LEDs) still have reliability issues that hinder the large scale application of LED devices. Nowadays, the reliability is becoming an essential barrier for LED devices to substitute the traditional light sources. Before it is applied into mass production,...
To improve the precision of equivalent plane method used to calculate structural system reliability, the concept of multiple correlation was adopted to structural reliability analysis, and multiple correlation-equivalent plane method was presented. With the multiple correlation coefficients which express the correlation between equivalent plane and other limit state surfaces, this method solves the...
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