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Impact behaviors of high-power LED are essential due to the possible poor adhesion of interfaces and should be studied. In this study, the analysis of dynamic response for high-power LED module under impact load is conducted with simplified theoretical analysis, experimental testing and numerical simulation. A self-made microelectronics drop impact tester is established. Then reliability performances...
As the market is desperate for better performed, miniaturized, highreliableand lower-priced electronic devices, nowadays, three dimensional integrated circuit (3D IC) seems to be a promising technology which can meet these requirements. However, many issues hinder this technology from being developedrapidly, among which the reliability of through silicon via(TSV) is one of the major concerns. Because...
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