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Advanced packaging and heterogeneous integration are major drivers for future electronic systems. Examples include 3D-IC, wafer level packaging, embedded components, and system in package. To realize the benefits of advanced packaging and heterogeneous systems integration, design flows, circuit-level simulations, and physics-based modelling will need to address the challenges for chip-package-system...
The impact of conformal coating penetration on the solder joints' thermal fatigue reliability in QFNs was studied using computational modeling techniques. 3D finite element models were developed with consideration of realistic solder joint shape and the actual coating profile. Thermal mechanical simulations were carried out for three cycles under accelerated thermal test conditions of −25 to 100°C,...
This paper details the current status and future requirements of modelling and simulation tools in supporting chip, package, and board level co-design for advanced packaging (3D-IC's with TSV's, WLP, SiP, etc.) of heterogeneous integrated systems. These tools will drive innovations across the die-package-system domains by optimizing electrical, thermal, mechanical and reliability performance for a...
Aerospace, Defence and High Performance (ADHP) industry has little choice but to rely on the use of commercial-of-the-shelf (COTS) electronics components for their products and equipment. As these electronics components are now predominantly packaged as lead-free (Pb-free) to comply with RoHS and other similar legislations, their use in high reliability and long service life applications is highly...
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