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Nowadays, microchannel‐based cooling systems are one of the best heat exchangers to extract a huge amount of heat from miniature devices. In this present study, a 15‐μm thickness porous fin in solid/porous compound wavy (CWPF) with a 45° secondary channel (SC) heat sink has been investigated with a Reynolds number range of 50–300 and is compared with CWPF heat sinks. Fluid flow through porous fins...
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