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Wireless Body Area Networks (WBANs) are one of the key technologies that support the development of digital health care, which has attracted increasing attention in recent years. Compared with general Wireless Sensor Networks (WSNs), WBANs have more stringent requirements on reliability and energy efficiency. Though WBANs are applied within limited transmission range, the on-body channel condition...
Solder is widely used in electronic packaging to connect die and substrate in die attach process. It is important to get a uniform solder distribution to provide good electrical conductivity, mechanical support as well as excellent thermal properties for packages, especially for power packages with high current densities. While nonuniform solder distribution would emerge when die moves and tilts in...
Ultrasonic heavy aluminum wire bonding whose wire diameter is greater than 100 microns has been the dominant interconnection technology in IGBT modules to implement the electrical connection among chips, DBC substrates and electrode terminals. During the switching on/off operation, the stress concentrates in the bond wire induced by the coefficient of expansion (CTE) mismatch between Al wire and silicon...
An optimal structural design of direct bonding copper (DBC) substrate with ladder shaped copper layers was proposed through numerical optimization approach in this paper. In order to study the fatigue mechanism and life, thermal–mechanical stress and strain distributions of DBC substrates under thermal cycling ranged from −55°C to 150°C were simulated and analyzed by finite element (FE) method. Improved...
Due to the mismatch of coefficient of thermal expansion (CTE) among different structure material, warpage and stress would be generated in the module and then influence the reliability and long term usage. This paper investigate a novel power electronic packaging design using integrated base plate (IBP). Module structure and assembly process of IBP-module have been introduced. The thermal and mechanical...
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