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It is necessary to analyze the mechanism of bump wafer probing, for bump height variation and probe mark area significantly influence flip chip assembly reliability. This causes the development of an effective and reliable testing method which becomes more important as the testing method has to satisfy the requirements of fine pitch and area array bumps. Certainly the vertical probe card is a reliable...
The purpose of this paper is to analyze the bump height variation and probe mark profile with various bump materials for wafer probing. It is necessary to establish different material bump wafer probing criteria, because the bump height variation and probe mark area have severe influence on the sort flip chip wafers that will affects the quality of the contact behavior and further impacts the flip...
Area-efficient resistor-capacitor DACs (R-C DACs) and low-offset push-pull output buffers for a 10-bit LCD source driver are proposed. Comparing to a 10-bit resistor-string DAC (R-DAC), the 10-bit R-C DAC has a smaller area. A new output buffer with a push-pull function is adopted so that the source driver can drive the pixel with two-dot inversion to save power consumption. To reduce channel to channel...
Wafer level testing within MEMS DLP (Digital Light Processing) device is a key issue for the expected growth of the MEMS market. MEMS devices' wafer sorting is hard due to a series of difficult factors, including the height of the glass, device pitch and complicated processes. Therefore, the general needle card can't be used to probing for these devices. In this paper, we develop a new ultra long...
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