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A system-level modeling approach, which combines the MoM (method of moments) and the SMM (scattering matrix method) has been presented for the modeling of advanced electronic packages (Oo et al., 2007). The focus of this paper is on addressing the problems of multilayered multiple via coupling and finite ground effects by the SMM method. Significant extensions of the SMM method facilitate the modeling...
A novel method for system-level modeling of advanced electronic packages is presented which is able to provide fast yet accurate simulation for signal and power integrity analysis of the multilayered electronic packages. The method is a semi- numerical approach based on the combination of the moment method and the scattering matrix method.
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