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A three-dimensional finite element model of miniature circuit breaker is established. The steady state temperature field is obtained by the method of electrothermal coupling, and the mechanism of overload protection is analyzed. The influence of wire size on the temperature of bimetal is studied. A simple and effective method to reduce the influence of external wire size is presented. The influence...
With the trend of electronic consumer product toward more functionality, high performance and miniaturization, IC chip is required to possess more I/Os and superior electrical characteristics and packaging is required to offer more pins out under same form factor. Thus flip chip BGA (FCBGA) package was developed to meet those requirements offering excellent electrical performance, more I/O pins accommodation...
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