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In this article, the microstructures and the properties of Sn–9Zn/Cu and Sn–9Zn–0.06Nd/Cu soldered joints with aging at a constant temperature 150°C for different hours were studied. It was found that the microstructure of Sn–9Zn–0.06Nd solder aged for 240h remarkably changed and formed a combination net of Sn grains due to diffusion and aggregation of rare earth element Nd. Moreover, the interfacial...
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