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QFN (Quad Flat No-lead) packages become popular in recent years because they provide many advantages over conventional leadframe packages. Due to CTE (Coefficient of Thermal Expansion) mismatch of different materials applied in the package, significant warpage will be generated during QFN packaging process, and may cause yield and reliability issues. In this paper, the warpage of a QFN strip induced...
This paper gives a detailed investigation on TSOP warpage mechanism. The influences of all the factors on warpage behavior, including materials (EMC ingredient and lead frame), lead frame design and assembly process, were investigated through numerical simulation and experimental study. The simulation result showed that low CTE material is a good choice for warpage reduction. And it also indicated...
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