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The electromigration (EM) of a solder ball under high-current stressing causes it damage and reduces its service life. Previous studies suggest that the EM life of solder can be improved by properly selecting the solder stress property (compressive or tensile) at the corners where the electron current enters and exits, but complete and relevant research on this proposition is absent. In this paper,...
It was suggested that electromigration (EM) life of solder can be improved by proper choice of stress property (compressive or tensile) at the two corners where electron current enter and exit. In this paper, we investigated this problem systematically by experiment and finite element simulation. The experimental results show that, compared with the case of tensile stress, the meantime to failure...
In this paper, failure modes of solder under electromigration were shown, the failure mechanism was usually attributed to tensile stress at cathode and compressive stress at anode. To evaluate the electromigration induced stress in solder, a finite element model was developed basing on the coupling equation of stress-mass diffusion with the aid of user development on the platform of ABAQUS. Simulation...
Special specimen was designed to study the morphology change of SnAgCu solder under the influence of electromigration (EM) alone. High current stressing was applied to the specimens so that EM of solder would happen at both room and high temperatures. The interfacial crack at cathode is the main failure mode, although the positions of crack maybe different under different temperatures. Localized hillocks...
Special specimen was designed to study the morphology change of SnAgCu solder under the influence of electromigration (EM) alone. High current stressing was applied to the specimens so that EM of solder would happen at both room and high temperatures. The interfacial crack at cathode is the main failure mode, although the positions of crack maybe different under different temperatures. Localized hillocks...
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