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In this work, the interfacial reactions and IMC growth of the Sn–35Bi–1Ag on Cu, Ni–P/Cu and Ni–Co–P/Cu were studied during reflowing at 220 °C for 10 min and solid–state treatment at 150 °C with various aging times. For the solder joints of Sn–35Bi–1Ag/Cu, Cu6Sn5 IMC was formed at the interfacial layer after soldering, while Cu3Sn appeared after aging treatment. In the case of the electroless Ni–P...
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