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In this paper the influence of adding ELD barrier and capping layers in die shear strength of 3D stacked chips is discussed. Electroless NiB is used as barrier layer to prevent solder or UBM consumption and immersion Au is used as capping layer to improve the solder wettability. In this study UBM layers are Cu, Co and Ni and pure Sn is used as solder. For bonding both reflow and TCB methods are employed...
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