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An improved Cu-Cu joint strength was achieved by a pressureless sintering bonding using microscale Cu particles with an oxidation-reduction process for power device packaging. After the bonding at 300 °C in air, Cu2O nanoparticles uniformly formed on the surface of microscale Cu particles through a thermal oxidation, and the formation of neck between microscale Cu particles was obvious. Then, after...
The mechanical and microstructural change of Ag NPB with ENIG finished Cu and bare Cu were investigated. The results of shear test of NPB with ENIG finished Cu and bare Cu substrates show 25.7 and 26.6 MPa. The effect of surface finish became significant with increasing of aging time. In case of bare Cu substrate, the shear strength gradually decreased with increasing of thermal storage time, and...
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