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There is an increasing demand for polyimide (PI) with excellent mechanical properties, good heat resistance, and low dielectric constant in integrated circuits and advanced packaging. Based on this, we report a strategy of tailoring the PI via fluorinated nanofillers modification to improve its mechanical properties, heat resistance, hydrophobicity, and reduce its dielectric constant. Specifically,...
One challenge in the high‐performance dielectric material of polyimide (PI) is to obtain the excellent comprehensive properties at low curing temperature for advanced IC package. In this work, 6‐aminoquinoline (AQL) is introduced through covalent bonds for end capping to obtain a low‐temperature curable PI at first. The results demonstrate that with very limited introduce (2.76%) of AQL, the imidization...
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