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In three-dimensional integrated circuit (3D-IC) systems that use through-silicon via (TSV) technology, a significant design consideration is the coupling noise to or from a TSV. It is important to estimate the TSV noise transfer function and manage the noise-tolerance budget in the design of a reliable 3D-IC system. In this paper, a TSV noise coupling model is proposed based on a three-dimensional...
An analog-to-digital converter (ADC) is an essential device in mixed mode systems. The performance of the ADC, however, is deteriorated by coupled power supply noises through hierarchical chip-PCB power distributed networks (PDNs). In order to design a high-performance system, modeling and analysis of power supply noise effects on the ADC are necessary, as the power supply noise is coupled to the...
This paper presents a wireless and high-speed transceiver system for Ultra-Wideband (UWB) communication with a high noise immunity. A proposed transceiver system has a high-speed data transmission up to 130 Mbps. Then, the measurement setup for the noise immunity test is introduced. Also, in order to demonstrate a noise immunity of the system, timing jitter, accumulated waveform, and bit error rate...
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