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Diamond/Cu-xCr composites were fabricated by pressure infiltration process. The thermal conductivities of diamond/Cu-xCr (x = 0.1, 0.5, 0.8) composites were above 650 W/mK, higher than that of diamond/Cu composites. The tensile strengths ranged from 186 to 225 MPa, and the bonding strengths ranged from 400 to 525 MPa. Influences of Cr element on the thermo-physical properties and interface structures...
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