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Leakage mechanism of a copper single damascene structure with a porous organic low-k polymer as the inter-metal dielectric between 1 and 4 mV/cm is investigated. Constant-rate voltage ramp is the main tool for investigation. Experiments were conducted between 25 and 250 °C. Passivated damascene structures with fully dense and porous copper diffusion barriers were investigated. If a fully dense barrier...
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