Serwis Infona wykorzystuje pliki cookies (ciasteczka). Są to wartości tekstowe, zapamiętywane przez przeglądarkę na urządzeniu użytkownika. Nasz serwis ma dostęp do tych wartości oraz wykorzystuje je do zapamiętania danych dotyczących użytkownika, takich jak np. ustawienia (typu widok ekranu, wybór języka interfejsu), zapamiętanie zalogowania. Korzystanie z serwisu Infona oznacza zgodę na zapis informacji i ich wykorzystanie dla celów korzytania z serwisu. Więcej informacji można znaleźć w Polityce prywatności oraz Regulaminie serwisu. Zamknięcie tego okienka potwierdza zapoznanie się z informacją o plikach cookies, akceptację polityki prywatności i regulaminu oraz sposobu wykorzystywania plików cookies w serwisie. Możesz zmienić ustawienia obsługi cookies w swojej przeglądarce.
Copper chemical mechanical polishing (CMP) and wafer thinning technologies have been challenges for Through Silicon Via (TSV) interconnect in recent years. In this work, copper CMP slurry and process and wafer level thinning with temporary bonding were studied in detail. The concentration of peroxide (H2O2), citric acid, SiO2 particle and Benzotriazole (BTA) in the CMP slurry and their effects were...
An analysis methodology to determine heavy metal emission based on the whole product process was developed. In this article, the smelting technology and the raw materials components of the secondary copper smelting were introduced to analyse the amount of lead waste the site create per year. The balance of lead element gave the kinds and quantity of the waste including lead element clearly. The dust...
In this paper, micro-corrosion of Al/Cu/W bond pad was studied. During DI water cleaning process, theta phase Al2Cu and surrounding Al performed well as typical galvanic cell, resulting in pad metal micro-corrosion. DI water with Pb2+ is thought to be outside electrical path of the galvanic cell. It is firmly believed that Pb-contained particles on top of Al2Cu and surrounding Al oxide and/or hydroxide...
This paper deals with the extracellular polymeric substance (EPS) of Rhizobium radiobacter F2 used as a novel biosorbent to remove Cu (II) and Mn (II) ions from aqueous solutions. The Cu (II) and Mn (II) ions biosorption characteristics of the EPS were examined as a function of initial pH, contact time and EPS concentration. The proper pH of the aqueous solution was found to be 6.0 for both the biosorption...
South Taihu Lake used to get less attention in terms of environmental pollution study in the past. Sediment and fish samples were collected from South Taihu Lake in 2009. Heavy metals were measured for both types of samples and potential health risks were evaluated. Concentration of Cu, Zn, Cr and Ni were determined for sediments samples, and Cu, Zn, Ni, Fe and Mn were determined for fish samples...
For electroplated Sn and Sn alloy finishes, one of the reliability concerns remains the risk of whisker growth. Results from recent work have suggested that whiskers are most likely to form in regions of the films where high stress or a stress gradient exists. If strain/stress distribution information can be collected at a grain-by-grain level, correlations between such information and the propensity...
The South Taihu Lake receive localized metal pollution from the factories nearby. The aim of this study was to find out the heavy metal accumulation in South Taihu Lake. Concentration of some heavy metals (Cu, Zn, Cr, Ni, Pb, Cd) were determined in sediments samples. Heavy metal levels were analyzed by ICP. Concentrations varied significantly from different sampling sites. The results showed that...
With the fast development of World Wide Wed, Web-based applications and services should allow user to get the right personalized information quickly and effectively. User profile acts a very important role both in Web service personalization and information sharing. In this paper, a new user profile model was proposed to store the characteristics and preferences of person. By using intuitionistic...
The electromigration of flip chip solder joints is an ongoing reliability concern for manufacturers of integrated circuit (IC) components and electronic systems. As power levels of ICs continue to increase, current densities within individual solder bumps often increase, along with the operation temperatures of the die surface. Both of these factors have detrimental impact on the electromigration...
Podaj zakres dat dla filtrowania wyświetlonych wyników. Możesz podać datę początkową, końcową lub obie daty. Daty możesz wpisać ręcznie lub wybrać za pomocą kalendarza.