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Thermomechanical reliability of the metal packaging with low-resistance and high-electric current was discussed in this paper. Thermal deformations and stresses of packaging structures were studied by both experimental and numerical methods. Laser speckle interferometry was used as the experimental method to test the coefficient of thermal expansion of the metal composite leads and the thermal deformations...
The die edge-seals and circuit under fad (CUF) are structurally optimized through 3D finite element analysis (FEA). Die edge-seals having the mechanically reinforced structure units are demonstrated essential. It is also shown that FEA help extract useful structural design concepts for CUP. The Poisson effects leading to a dual-ring-shaped high stress distribution area are confirmed to be detrimental...
As the technology of the semiconductor process continues to move forward, the next generation IC chip with copper/low-k stacked structures is being developed for reducing the RC delay in order to obtain high-speed signal communication. However, there is a high potential that in doing so it may contribute to interfacial cracks occurring or propagating between the copper interconnections and the low-k...
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