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As modern electronics move towards miniaturization, high-degree integration and multifunctionalization, a large amount of heat will be generated during the operation of electronic devices. Redundant heat will cause the failure of electronic devices. One important solution is to fabricate thermally conductive composites to replace conventional packaging materials. Herein, we report on fabrication of...
Thermal management issue has been a bottleneck with the development of modern electronics towards higher speed, miniaturization and functionalization. To address this problem, novel polymer composites with improved thermal conductivity is strongly demanded. However, traditional polymer composites with roughly designed structure and high filler content usually cannot meet the increasing requirements...
Heat generated by electronic devices and circuitry must be dissipated to improve their performance, reliability and prevent the premature failure. One of important methods is to fabricate composites with high thermal conductivity. In this study, we develop a novel approach for surface modification of boron nitride nanosheets and silicon nanowires by being decorated with silver nanoparticles. The resultant...
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