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Incorporating reinforcements into solder is an effective way to inhibit the growth of interfacial IMCs layer and also improve the mechanical properties of solder joints. In this study, some composite solders were prepared by adding of four types of reinforcements into SAC305 solder matrix respectively, including SiC nanowires, SiC, ZnO and Ni nanoparticles through the methods of mechanical ball milling...
Sn3.0Ag0.5Cu(SAC)-XAl2O3(X = 0.2, 0.4, 0.6, 0.8 wt.%) composite solders reinforced with Al2O3 nanoparticles were prepared through the powder metallurgy route (ball milling, compacting and sintering). After ball milling, the morphology of composite powder was studied by scanning electron microscopy (SEM). In addition, the prepared composite solders were characterized in terms of their microstructure,...
A novel SiC doped SAC305 composite solder was developed by mechanically mixing various amount of the SiC whiskers with Sn-3.0Ag-0.5Cu solder paste. The effect of SiC whiskers addition on microstructure, microhardness and wettability of the composite solders was investigated. It was found that the eutectic structure was refined in the composite solder, and both of the microhardness and wettability...
Sn3.0Ag0.5Cu(SAC)-XAl2O3(X = 0.2, 0.4, 0.6, 0.8 wt.%) composite solders reinforced with Al2O3 nanoparticles were prepared through the powder metallurgy route (ball milling, compacting and sintering). After ball milling, the morphology of composite powder was studied by scanning electron microscopy (SEM). In addition, the prepared composite solders were characterized in terms of their microstructure,...
A novel SiC doped SAC305 composite solder was developed by mechanically mixing various amount of the SiC whiskers with Sn-3.0Ag-0.5Cu solder paste. The effect of SiC whiskers addition on microstructure, microhardness and wettability of the composite solders was investigated. It was found that the eutectic structure was refined in the composite solder, and both of the microhardness and wettability...
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