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Owing to its good welding performance and lower cost, SAC0307 has been considered as one of the most promising solders to replace SnPb alloy and become popular lead-free solder in electronic packaging field. However the reduction of silver content brought some problems in strength, thermal fatigue behavior and creep resistance for this kind of joint as well. Adding filler to solder matrix so as to...
Throughout the development of electronic packaging technology, Sn-58Bi lead- free solder has been widely applied because of its low-temperature welding. However, during the production process, the formation of solder bead is a terrible problem that is commonly encountered with Sn-58Bi solder joint. This problem not only damages the macroscopic appearance of the solder joint, but may encompass other...
Whisker formation mechanism has been widely investigated for recent decades since its great influence on degrading the reliability of the electronic devices. In our work, effect of current stressing on whisker growth in Cu/Sn3.8Ag0.7Cu/Cu and Cu/Sn58Bi/Cu solder joints was investigated. Results show that after current stressing for a long time, many whiskers are observed in some local regions at the...
Microstructure evolution and temperature distribution of eutectic SnBi solder joint under high current density of 1×104A/cm2 at room temperature were investigated in the current study. With the increase of current stressing time, a continuous Bi segregation layer was formed and grew along the interface at the anode side, and a Sn rich region was found at the cathode side. Due to the microstructure...
Silver-Copper-Palladium (Ag-Cu-Pd) brazing alloy is an important material used for vacuum electronic devices packaging for its low vapor pressure, good air tightness, excellent wetting property, and mechanical properties. The Ag-Cu-Pd brazing alloys are proposed for the vacuum electronic devices packaging in these few years. Ag-Cu-Pd alloy is one of the common mid-temperature and high-temperature...
For real solder joints used in electronic devices, EM and creep may be two relevant reliability problems because solder joints usually serves under a combination of current stressing, elevated temperatures, and mechanical loading conditions. Especially when the size of solder joints scales down and current density escalates, EM-induced microstructure change should have certain impact on creep behavior...
The reliability issues such as creep, electromigration (EM), and thermal fatigue of solder joints in real service condition have gained much attention due to the rapid development of electronic devices towards multi-function, miniaturizing and portable tendency. There are many studies focusing on microstructure changes of solder joints under the single condition of creep, EM, or thermal fatigue. However,...
Silver-Copper-Palladium (Ag-Cu-Pd) brazing alloy is an important material used for vacuum electronic devices packaging for its low vapor pressure, good air tightness, excellent wetting property, and mechanical properties. The Ag-Cu-Pd brazing alloys are proposed for the vacuum electronic devices packaging in these few years. Ag-Cu-Pd alloy is one of the common mid-temperature and high-temperature...
The reliability issues such as creep, electromigration (EM), and thermal fatigue of solder joints in real service condition have gained much attention due to the rapid development of electronic devices towards multi-function, miniaturizing and portable tendency. There are many studies focusing on microstructure changes of solder joints under the single condition of creep, EM, or thermal fatigue. However,...
For real solder joints used in electronic devices, EM and creep may be two relevant reliability problems because solder joints usually serves under a combination of current stressing, elevated temperatures, and mechanical loading conditions. Especially when the size of solder joints scales down and current density escalates, EM-induced microstructure change should have certain impact on creep behavior...
Whisker formation mechanism has been widely investigated for recent decades since its great influence on degrading the reliability of the electronic devices. In our work, effect of current stressing on whisker growth in Cu/Sn3.8Ag0.7Cu/Cu and Cu/Sn58Bi/Cu solder joints was investigated. Results show that after current stressing for a long time, many whiskers are observed in some local regions at the...
Microstructure evolution and temperature distribution of eutectic SnBi solder joint under high current density of 1×104A/cm2 at room temperature were investigated in the current study. With the increase of current stressing time, a continuous Bi segregation layer was formed and grew along the interface at the anode side, and a Sn rich region was found at the cathode side. Due to the microstructure...
Nowadays, the combination effects of thermal, mechanical and electrical on the reliability issues of solder joint gain more and more attentions. The independent failure mechanisms of solder joints are widely investigated and comprehended under single conditions as listed above. However, the coupling effect of thermal, mechanical and electrical needs further exploration. Consequently, the failure behaviors...
Improving the reliability of solder joints is an urgent issue to guarantee the quality of surface assembly products. The size of components and pitches on the circuit board differs from each other which leads to the size of solder joints variation one by one. In this study, the size effect of solder powder on Sn-3.0Ag-0.5Cu solder joints in high density LED display packaging was investigated. The...
This work focused on the electromigration (EM) behavior of the Cu/Sn-58Bi/Cu solder joint affected by the large void formation. The as-reflowed one-dimensional solder joint was stressed with current density of 5×103 A/cm2 at 80°C continuously for 144h. The microstructural evolution was observed and analyzed by SEM. Results indicated that the abnormal Sn/Bi phase segregation was observed at the cathode...
Basic understanding of heating conduction in lead-free solder joints due to the Joule heating effect was carried out by using the infrared (IR) microscopy. In order to interpret the corresponding mechanism and provide a better understanding to Electromigration (EM) studies, a newly developed ID solder joint with same cross-sectional area in solder alloy and Cu electrodes was employed in our thermal...
Due to the excellent resistance to thermal mechanical fatigue and creep resistance properties of in-situ Cu6Sn5 reinforced composite solder, it's meaningful to further investigate the Electromigration (EM) behaviors of such novel composite solder. We used in-situ method to prepare Cu6Sn5 reinforced Sn-3.5Ag composite solders, the weight fraction of which was 1 vol.%, 5 vol.%, and 20 vol.%, respectively...
Alternating current will lead to more complex phenomenon in electromigration (EM) compared to one directional current, in terms of the different controlling mechanisms. Therefore, Sn-based joints will exhibit unique characteristics of electromigration under reversed current stressing. Eutectic SnBi solder was used as the main research object in the current study. The ambient temperature was set to...
Electromigration (EM) has become one of the reliability concerns to the fine pitch solder joint due to its increasing capacity to bear the high current density The EM effects on microstructure evolution of Sn-3.0Ag-0.5Cu+XNi (X=0, 0.05, 0.45, 2.0wt. %) solder joint was investigated. Findings of this study indicated that an appropriate addition of Ni element and moderate ambient temperature can alleviate...
The in-situ measurement of the stress evolution at the anode and cathode interfaces of the Cu/3.0Ag0.5Cu/Cu solder joints with current density of 4 × 103A/cm2 at room temperature by X-ray diffraction technique was investigated. The experimental results showed that the stress evolution at the interfaces was a very complicated process during current stressing, which owed to many influencing factors...
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