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Isothermal aging effect on the microstructure and mechanical properties of line-type Ni/Sn3.0Ag0.5Cu/Ni sandwich structure interconnects with small heights of 50 and 25 μm was investigated in this study. Microstructural analysis showed that interfacial (Ni, Cu)3Sn4 IMC layer grew thick after aging at 125 °C for 100 h with the formation of local voids and cracks due to volume shrinkage induced by the...
The microstructural evolution and mechanical behavior of line-type Ni/Sn3.0Ag0.5Cu/Ni interconnects with a small thickness (or height) of 100 µm during isothermal aging were investigated. Microstructural analysis shows that both (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 IMC phases formed at the interface of the as-reflowed joints; however, after the aging treatment at 125 °C for 100 h or more, the interfacial (Cu,Ni)...
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