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Aurora ® ELK films were fabricated by PE-CVD of a SiCOH matrix precursor and an organic porogen material. The porogen material is removed during a subsequent thermally assisted UV-cure step with a short wavelength UV-lamp (λ<200nm). This results in film thickness shrinkage of 13.2% and a robust low-k film with k-value∼2.3, elastic modulus ∼5.0GPa and intrinsic film stress ∼59MPa. The microscopic...
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