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Cu-Cu thermocompression bonding is the most widely accepted bonding approach for realizing multilayer chip stacking in three dimensional integrated circuits. Recently new materials and structures such as one-dimensional metallic nanostructures have been extensively investigated for the application of Cu-Cu interconnection due to their superior electrical, thermal, and mechanical properties. Herein,...
Randomly distributed silica nanowires show highly reflectivity in the whole visible wavelength, which can be used as white light coating for high-efficiency optoelectronic packaging as affirmed by our previous work. In this work, an improved process has been developed to recombine the silica nanowires as optical coating of LED reflector cup to form diffusive reflecting surface in LED packaging. This...
This paper presents an innovative technique of integrating silica nanowires to photoresist-derived carbon microelectromechanical systems (C-MEMS) on silicon substrate. The silica nanowires were synthesized through thermal treatment in a tube furnace at 1200 °C under a gaseous environment of N2 and H2. The stiff morphology and radicalized distribution around carbon posts of nanowires was observed,...
An integration strategy is devised for a reliable, scalable, and catalyst-free assembly of nanowires in photoresist-derived carbon microelectrodes. The approach involved UV photolithography process of SU8 photoresist, followed by high-temperature carbonization, and was versatile in yielding various 3-D micro–nano integrated carbon microelectrode arrays (CMEAs). The morphology...
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