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This paper demonstrates, for the first time, an integrated radio frequency (RF) front-end module (FEM) with precision matching circuits in ultra-miniaturized glass substrates for LTE applications. Through full-wave electromagnetic (EM) simulations, electrical performance of these glass-based long term evolution (LTE) packages is compared with traditional RF modules with surface mount devices (SMDs),...
This paper introduces an innovative concept of electrical-thermal co-design for high-Q 3D inductors using through-package-via (TPV)-based copper networks in ultra-thin power amplifier-integrated glass modules. The copper networks are designed to provide high quality factor inductors, and also simultaneously enable heat transfer in ultra-miniaturized glass packages. Such TPV-based 3D inductors achieved...
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