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The effect of isothermal aging on the microstructure and shear strength of Sn3Ag0.5Cu/Cu (SAC305/Cu) solder joints were studied systematically. The single-lap shear samples of SAC305/Cu solder joint were prepared and aged up to 456h at 150 and 180°C, respectively. The interfacial intermetallic compound layer of the aged solder joint gradually thickened with increasing both aging time and aging temperature,...
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