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In this work, the InAs/AlSb high electron mobility transistors (HEMTs) on GaAs semi-insulating substrate using refractory iridium (Ir) gate technology was proposed. The Ir-gate exhibited a superior metal work function which was beneficial for increasing Schottky barrier height of InAs/AlSb heterostructures to 0.58eV. Compared to the Ti-gate HEMT, the Ir-gate HEMT shows higher threshold voltage and...
The purpose of this study is to explore Thai online customers' repurchase intention towards clothing. This study integrated Delone and Mclean's e-commerce success model to predict customers' repurchase intention to purchase clothing on the Internet. The data was collected using convenience sampling method with a survey of the customers in Thailand who had experienced purchasing clothing online. The...
Based on the functional characteristics of robotic total station(TCA2003 total station) and the basic principle of GeoCOM interface technology, the paper discussed the solutions to several key problems found in the development process of automatic deformation monitoring system with GeoCOM. The automatic monitoring function of deformation monitoring system developed with GeoCOM has been realized through...
Business-To-Business (B2B) electronic-auction (e-auction) has become a popular tool in the business transaction process. However, there are several reasons that cause companies in Taiwan to be reluctant in using this tool. In this empirical paper, it provides a more distinctive direction to enhance the benefit and operational efficiency when seeking the use of e-auction. The obstacles for applying...
Marketing channel as the downstream end of a supply chain plays a crucial role in generating cash flow and meeting the demands of customers. The extant body of literature postulates that antecedent-consequence links that customer perceived value and service quality foster customer loyalty, leading to long term profitability. Nowadays, given the proliferation of global hypermarket organizations and...
The purpose of this research is to study the parametric factors of wire bonding and optimal design rules for 4-layer mini stack-die package. This paper demonstrates the characteristic of low loop height, fine bond pad pitch and long overhead staggered chip in mini SD package. The loop height is limited to 3.5mil, the diameter of gold wire is 0.8 mil and the bond pad pitch is 45mum. The collaborated...
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