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We present a novel MEMS capacitance accelerometer with single wafer symmetrical double-sided folded-beams structure. The highly symmetrical 8 folded-beams on single wafer is designed and fabricated by Deep Reactive Ion Etch (DRIE) and KOH wet etching from both sides of the silicon wafer. The sandwich differential capacitive accelerometer is formed by three-layer silicon-silicon bonding. The excellent...
This paper reports a tiny-sized (140μm×140μm) p-Si/Al infrared (IR) thermopile, which is low-cost bulk-micromachined only from the front-side of (111) wafer for IC-foundry compatible manufacturing. With the novel single-side bulk-micromachined structure, the tiny-size MEMS thermopile consists of six single-crystalline (SC) Si/Al thermocouples that show significantly higher Seebeck-coefficient and...
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