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The wettability evolution of eight different types of nanostructured cobalt films is investigated using galvanostatic electrodeposition. The morphology, which evolves from a plump, pea-like structure to cone, pyramid, shell, fluffy cone, fluffy shell and flower structures can be controlled by changing the anion type in the electrolyte or the deposition current density. A growth mechanism is proposed...
Copper nanowire is a promising material in the electronic packaging industry. However, at present, most of the preparation methods of Cu nanowires growing on substrates are highly dependent on templates or need relatively high temperature. In this study, Cu nanowires growing on substrates are synthesized by both pulse current electrodeposition and electroless plating, which is both template-free and...
Copper electrodeposited on nickel and copper alloys substrates is easy to be oxidized, and the adhesion between the oxides and substrates can be so poor that delamination happens at these interfaces, which may lead to an overall failure to the electronic device. In this work, three different substrates were prepared by applying direct current; of all these substrates the amorphous nickel-phosphorous...
Super-hydrophobic Nickel films were prepared by a simple and low cost electrodeposition method. The surface morphology of the films characterized by FE-SEM exhibit hierarchical structure with micro-nano cones array, which can be responsible for their super-hydrophobic characteristic (water contact angle is over 120 degree) without any chemical modification. The wettability of the film can be varied...
Co-Ni alloys have the properties of high hardness, good wear and corrosion resistance. A transition layer of Co-Ni coating will help enhance the hydrogen sensing stability of Pd films. In this work, Pd films were electrodeposited on Co-Ni coated copper substrate and silicon wafers. The influence of deposition parameters on the microstructure of Co-Ni coatings and Pd films were investigated. Experimental...
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