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The rapid development of three dimensional packaging makes it necessary to develop smaller and more reliable microbumps. In the electrodeposition process of bump cylinder, the filling quality is largely determined by the combination of additives. In this work, the effect and competitive adsorption between suppressor polyethylene glycol (PEG) and accelerator Bis-(3-sodiumsulfopropyl disulfide) (SPS)...
With the strength of fine pitch, high electrical conductivity and excellent reliability, copper pillar interconnect becomes a promising alternative to traditional solder bump. However, bad surface smoothness is a severe problem and significantly affects the reliability of the bump connection. In this paper, numerical simulations on the shape evolution of copper pillar bump and the effect of bump dimension...
The superfilling of through silicon vias (TSVs) is a technical challenge for the fabrication of modern 3D Electronic packaging. In order to achieve void-free-filling for TSVs with different aspect ratios, various organic additives need to be added into the plating bath. Since TSV filling is a complex electrochemical and physical process, it is difficult and very time-consuming to get an optimal additive...
A simple electroless deposition method of fabricating silver nanosheets which is a promising replacement for a high-temperature lead-rich solder used for electronics has been reported. This substrate free deposition method can solve the surface coating problem of the nanostructured silver. By controlling the deposition time, the silver nanosheets with a length of 2μm and a width ranging from 10nm...
A simple electroless deposition method of fabricating silver nanosheets which is a promising replacement for a high-temperature lead-rich solder used for electronics has been reported. This substrate free deposition method can solve the surface coating problem of the nanostructured silver. By controlling the deposition time, the silver nanosheets with a length of 2μm and a width ranging from 10nm...
The superfilling of through silicon vias (TSVs) is a technical challenge for the fabrication of modern 3D Electronic packaging. In order to achieve void-free-filling for TSVs with different aspect ratios, various organic additives need to be added into the plating bath. Since TSV filling is a complex electrochemical and physical process, it is difficult and very time-consuming to get an optimal additive...
In response to lead-free requirements and market forces, pure tin finishes have been widely used as a Pb-free option for semiconductor lead frames and electrical connectors in the microelectronics industry. Pure tin finishes could easy have a discoloration during reflow process since the reflow temperature is as high as 260°C, which could lead to a reliability issue. In this work, matte tin was electroplated...
The effect of polyethylene glycols upon copper electrodeposition in methanesulfonate electrolytes is discussed in this paper. By means of linear sweep voltammetry and electrochemical impedance spectroscopy, it is found that polyethylene glycols in methanesulfonat electrolytes have very different behavior from that in traditional sulfuric electrolytes. PEG can adsorb on electrode surface in absent...
Global escalating demand for energy is opening up the opportunities for utilization of solar energy, while photovoltaic (PV) cell is considered as one of the finest ways to harness the solar power. PV ribbon, which is a copper ribbon coated with tin-lead or lead-free solders, is one of the key PV cell components to connect cells. In this paper, tensile properties of PV ribbons coated with Sn-Pb were...
Though silicon vias filled by pulse reversal current, and influences of frequency of pulse current and reverse current density are investigated. Chronopotentiometry was applied to analyze the principle of these effects. It was found that when frequency is too high, the reverse current was mainly consumed in process of charge-discharge of electric double layer; it cannot play the role of dissolving...
Copper electrodeposition in acidic cupric methanesulfonate bath with organic additives is discussed in this paper. The influence of poly(ethylene glycol) (PEG) and bis-(3-sodiumsulfopropyl disulfide) (SPS) on copper deposition were studied by means of linear sweep voltammetry, cyclic voltammetry and chronoamperometry. These electrochemical analysises revealed a competition of PEG and SPS on electrode...
In this paper, a novel low-temperature micro-insert bonding technology for 3D package has been reported. Nickel microcone arrays (MCA) fabricated on the bonding pad was used as the under bump metallization (UBM). The bonding temperature is below the melting point of the solder. At certain temperature and pressure, the MCA inserted into the lead-free Sn-Ag-Cu solder bumps to achieve a good adhesion...
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