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Beam structure is widely used for MEMS (Micro-electromechanical Systems) design, the mechanical properties of beam structure are of great importance to guide the design of MEMS devices. Among the many properties, stress rupture properties are studied in this paper. The sensor based on piezoresistive effect with a specially designed cross-beam structure is proposed for stress rupture properties measurement...
In this work, compatible CMOS-MEMS process with surface micromachining is investigated. Surface micromachining method for cantilever fabrication has been merged with conventional CMOS process, and release of MEMS structure is conducted after CMOS process. We designed polysilicon MEMS structures as well as CMOS devices and circuits on a monolithic sensor chip for the investigation of the influence...
To investigate the mechanical strength of the anchor–microbeam combined structure, two series of devices (bonding quality testing devices and torsional strength testing devices) are designed and fabricated by the silicon-on-glass process. A novel array-shaped anchor scheme is presented, which has been compared with the conventional single anchor. The experimental results have shown that the bonding...
In this paper, a novel super-capacitor design based on the black silicon was introduced. The atomic layer deposition was designed to fabricate the dielectric and electrode layer. And the black silicon was chosen for the substrate. A specific MEMS process was also designed to achieve the contact between the metal electrode and electrode layer. The parallel-plate capacitor theory was employed for the...
The operating principle of the RF MEMS phase shifter is described. Then the equivalent circuit of the MEMS phase shifter has been established and the capacitances of the MEMS bridges in both ldquouprdquo and ldquodownrdquo state are analyzed. Then the approach of using the saw-shaped CPW to decrease the return loss introduced by the insulation layer is proposed. By using network theory, the circuit...
In this paper, a novel RF-MEMS phase shifter based on a rectangle bridge-like coplanar waveguide (BCPW) structure is proposed. The signal line of the coplanar waveguide (CPW) has symmetrical saw-shaped structures under the MEMS bridges above which covers the BCPW bridge. The CST software is used for the modeling, simulation and optimization the model of phase shifter from 30 to 40 GHz. Simulation...
A novel low-driven MEMS capacitive switch structure for microwave distributed phase shifter is presented based on the analysis of the operation principle. The driven voltage, response time, release time and vibration modes of the capacitive switch are analyzed using the Intellisuitetrade software. The simulation results show the driven voltage of 2.5 V, the response time less than 30 us, the release...
A novel packaging structure which is performed using wafer level micropackaging on the thin silicon substrate as the distributed MEMS phase shifters wafer with vertical feedthrough is presented. The RF performances of proposed structure are investigated using Microwave Studio (CST). The results show that the insertion loss (S21) and return loss (S11) was -0.4-1.84 dB and under -10 dB at 1-50 GHz....
In this paper, on-wafer level packaging technology for RF MEMS is described, and then a novel packaging design for RF MEMS devices with different fabrication technology at millimeter-wave band is presented. The discussed RF MEMS devices on naked wafer includes a MEMS filter and a distributed MEMS transmission line (DMTL) phase shifter, which are fabricated using LIGA and micromachined technology,...
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