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This paper reports a safe release mechanism for MEMS devices fabricated using plasma etching based dry processes. The proposed smart fuse is particularly designed for CMOS-MEMS devices where inherent CMOS thin films are used as structural materials. Properly designed polysilicon heater sandwiched between CMOS layers is the critical element of the fuse. Upon applying current through the heaters in...
Residual stress developed during thermal processes in fabrication is ubiquitous in MEMS devices. While the residual stress is exploited in many devices to generate initial displacements of freestanding structures in the device [1–2], it can also cause severe problems during and after device fabrications. Post-development of residual stress over long term can deteriorate the performance and even fail...
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