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A study was conducted to assess the backward compatibility of two different lead-free BGA components using Jedec Solderability testing method (JESD22-B102D). The test was conducted at component level. The two components tested were 29×29mm Thermally Enhanced PBGA (TePBGA-II) and 35×35mm Tape BGA (TBGA) with SAC387 and Sn3.5Ag solder balls. Four units from each of the two component types were used...
A study was conducted on BGA lead-free C5 solder joint system to compare SnAgNiCo versus conventional Sn3.8Ag0.7Cu solder alloy. This study showed that SnAgNiCo C5 solder system performed better than Sn3.8Ag0.7Cu in terms of joint strength and brittle mode failure. Shear and pull strength was measured by Dage which is representative of the intermetallic (IMC) strength between the C5 solder sphere...
Various reflow profiles have been applied on different no-clean fluxes amount in removing the oxide layer of high lead solder bump. The wafers exposed to open air induce an oxide layer on the high lead solder bump. This oxide layer eventually creates the non wet phenomena in flip chip packaging. An experimental study is carried out by varying different soak time of the reflow profile to optimize the...
In the recent years, lead-free solder material have been increasingly applied to the green semiconductor products for RoHS compliance. For Flip Chip Plastic Ball Grid Array (FCPBGA), recent industry trend is changing from ENIG pad finishing to Solder-on-pad (SOP) pad finishing using Sn3.0Ag0.5Cu to improve board level reliability due to black pad issue on ENIG pads. However, SOP has posted a challenge...
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