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An electrical interconnect test method and a testable design method are proposed of a 3D stacked ICs made of dies in which boundary scan flip flops are not embedded in this paper. Open defects occurring at interconnects between dies designed by the testable design method are detected by the test method. In order to examine feasibility of the electrical tests, a PCB circuit is tested by the test method...
In this paper, a built-in supply current test circuit is proposed to detect open defects occurring at interconnects between dies including an IEEE 1149.1 test circuit and locate the defective interconnects in a 3D IC. Feasibility of interconnect tests with the test circuit is examined by some experiments with a prototyping IC in which the test circuit is embedded and by Spice simulation. The simulation...
In this paper, a supply current test method of 3D ICs is proposed to detect open defects occurring at interconnects between two dies in which IEEE 1149.1 architecture is implemented and locate the defective interconnects. Also, a testable design method is proposed for the test method and a testable designed IC is prototyped. Furthermore, testability of the test method is evaluated by some experiments...
In this paper, we propose a supply current testable resistor string DAC of decoder type whose area overhead is small and a supply current test method. Open defects and short ones in the DAC can be detected by the test method with about 50% of the exhausted test vectors. It is shown by some experiments that most of the targeted defects in our testable DACs of 4 and 8 bits can be detected by the test...
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