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An electrical interconnect test method and a testable design method are proposed of a 3D stacked ICs made of dies in which boundary scan flip flops are not embedded in this paper. Open defects occurring at interconnects between dies designed by the testable design method are detected by the test method. In order to examine feasibility of the electrical tests, a PCB circuit is tested by the test method...
A CMOS image pixel circuit is proposed which is able to be tested by an electrical test method in this paper. The image pixel circuit is tested as an analog circuit without irradiating light to it. A CMOS image sensor is designed to evaluate testability of the pixel circuit. It is shown by SPICE simulation whether 89% of open defects inserted in the image pixel circuit are detected by the electrical...
A testable design method for electrical testing is proposed in this paper to detect open defects occurring at interconnects between dies in a 3D IC and locate the defective interconnects. An IEEE 1149.1 test circuit is utilized to provide a test input vector to a targeted interconnect in the electrical tests. Feasibility of the electrical tests is evaluated by Spice simulation. It is shown by the...
A testable design method for electrical testing is proposed in this paper to detect open defects occurring at interconnects between dies in a 3D IC and locate the defective interconnects. An IEEE 1149.1 test circuit is utilized to provide a test input vector to a targeted interconnect in the electrical tests. Feasibility of the electrical tests is evaluated by Spice simulation and some experiments...
In this paper, we propose a supply current testable resistor string DAC of decoder type whose area overhead is small and a supply current test method. Open defects and short ones in the DAC can be detected by the test method with about 50% of the exhausted test vectors. It is shown by some experiments that most of the targeted defects in our testable DACs of 4 and 8 bits can be detected by the test...
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