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Low-temperature silver sintering technology, which has been proven to be a promising die-attach solution, was extended to bonding large substrates. Strong bonding strengths for substrates greater than 25 mm × 50 mm were achieved by sintering a nanosilver paste at temperatures below 270°C with less than 5 MPa pressure. To characterize thermal performance of the substrate-attach interface, we applied...
Recently, silver paste, silver epoxy, and solders were commonly used as die-attach materials for power electronic packaging. Thermal performance of these materials should be paid attention to since reliability of sintered or soldered jointsis highly dependent on the thermal performance. To accurately investigate the transient thermal behavior of sintered or soldered joints in electronic applications,...
One of the most important steps in the manufacturing of laser diodes is bonding the chip onto some sort of sub-mount that allows the laser to be handled, durable electrical connections to be made, and heat to be conducted away from the laser itself. The ability to conduct heat away from the laser is critical in keeping operating temperatures low, thus improving the laser's performance and its lifetime...
High power semiconductor lasers have found increasing applications in many areas. The junction temperature rise may not only affect output power, slope efficiency, threshold current and lifetime, but also cause spectral broadening and wavelength shift, which makes thermal management one of the major obstacles of pump laser development. Therefore, developing optimized thermal design solution becomes...
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