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A superhydrophobic polymerized n-octadecylsilane (PODS) surface with a highly ordered lamellar structure was obtained via a one-step solution immersion process. The PODS surface had water contact and sliding angles of 159° and ∼0°, respectively. A hydrophilic/superhydrophobic surface was then obtained by chemically bonding nano-SiO 2 onto the PODS surface. This SiO 2 /PODS layer exhibited...
With the continuously increasing packaging density, the corresponding techniques for heat dissipation are vital to high performance components. During the system operation, the heat generated by components must be efficiently transferred outside of the electronic package. To meet the heat removal requirement of the electronic devices with a high power, several liquid cooling schemes have been suggested,...
The micro-pin-fins prepared on the back side of the power chip enable heat removal on the level of modern microsystem demands. Carbon nanotube (CNT) has been proven to be a potential material for micro-cooler because of its superior advantages including high thermal conductivity, good mechanical property and so forth. And there emerges various applications of CNT in the micro-cooler system. In the...
Carbon nanotube (CNT) can be used in micro-channel cooler construction due to its excellent thermal conductivity. When fabricating CNTs directly onto the chip, the chip could be damaged because of the high temperature required for CNT growth (about 750°C). As a solution, a transfer technique is developed where the desired carbon nanotube pattern can be obtained by taking off a pre-fabricated CNT forest...
Micro-channels are generally regarded as an effective method for the heat transfer in electronic products, and much effort has been put into improving their capacities. At the same time, carbon nanotubes have shown great potential in the field of heat transfer. This paper focuses on the microchannel heat sinks combined with carbon nanotubes. A series of 3D models had been created, and the heat transfer...
The present paper paid particular attention to the flow and heat transfer performance for an array of micro jets impinging upon the dimpled surface by means of CFD modeling. The modeling of a three-by-four jet array impinging upon the smooth, concave- and convex-dimpled surfaces was carried out based on the solution of the steady, incompressible and three-dimensional RANS and energy equations by employing...
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