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Package lid is usually mounted above the integrated circuits (ICs) to protect the die and improve the thermal performance. However, the package lid may be an unintentional radiation contributor due to the resonance of package lid and package substrate. In this paper, based on a typical wire-bonded ball grid array (WB-BGA) package, perfect magnetic conductor (PMC) packaging is used to suppress the...
This paper presents analysis of substrate integrated waveguide (SIW) structures using contour integral equation method. By ignoring the field variation in vertical direction, the SIW structure is decomposed into internal and external problems. The internal electromagnetic (EM) fields are governed by the contour integral equation, while the external EM fields are computed from the equivalent magnetic...
The trend of most electronic products is toward higher operating frequencies. Recently the microwave modules have been used worldwide step by step in high frequency application. In this paper, the reliability of bonding between substrate and metal cavity of microwave module is studied. Two different kinds of bonding methods are introduced, which are bonding with adhesive or with solder paste respectively...
Power and ground planes are the major noise sources in the electronic package and multi-layered printed circuit boards. We propose a novel imaging method to simulate the impedance of power and ground planes. In the proposed method, the noise propagation between the power and ground planes is equivalent to a two-dimensional transverse magnetic problem. The electromagnetic wave multi reflections from...
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