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This paper describers the history and trends of application about TPMS, mainly introduces the basic principles of transmitter based TPMS, the structure of the system, as well as the main features of components. To solve the problem of reducing the power of the direct-type TPMS system from the engineering Application Perspective, It focuses on software processes of achieving low power consumption and...
We present the Ge/SiGe quantum well structure as a candidate for CMOS compatible light source. Thermal enhancement of electroluminescence from temperature dependent measurements agree with theory and indicates promise for an efficient Ge light source.
We present a steady state technique enhanced with micro-Raman spectroscopy to measure thermal conductivity of SOI silicon device layer. This metrology, comparing to conventional technique based on thermistor, exhibits two improvements: robustness against ambient disturbance, which leads to an error of 28%, and reduction on measurement system error from 20% to 10%.
Through-silicon vias (TSVs) have garnered a lot of interest in recent years because TSV is a key enabling technology for three dimensional (3D) integrated circuit (IC) stacking, silicon interposer technology, and advanced wafer level packaging (WLP). There has been significant effort in TSV fabrication and electrical design. However, considerably less work has been done on thermo-mechanical analysis...
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