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This paper presents the fabrication and thermal stability of the Ru electrode used for high power Ru-Au contact RF MEMS switch with microspring contact design. Here we develop a new process with bilayer lift-off and strain release layer to get the 3000 Å Ti/Au/Ru electrode with excellent smooth edge for high power handling and low loss. Furthermore, the thermal test at 400°C, 500°C and 600°C over...
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