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Microfluidic cooling shows promise in cooling next generation 3D microsystems when integrated with through-silicon-vias. In this work, electrical and thermal effects of staggered micropin-fin heat sink dimensions are analyzed using deionized water. An experimental study of five different silicon micropin-fin arrays with a nominal height of 200 µm and diameters down to 30 µm was conducted at flow rates...
A novel chip I/O technology, which enables high-bandwidth signaling, embedded microfluidic cooling and power delivery for high-performance 2.5D (silicon interposer) and 3D integrated circuits is presented. It features annular-shaped fluidic microbumps with 150 μm inner diameter and 210 μm outer diameter and fine-pitch electrical microbumps with 25 μm diameter and 50 μm pitch. Silicon dice with the...
Future high performance 3D systems require a systematic co-design of their electrical interconnect network and their heat removal mechanism. This paper presents fine pitch (20µm) and high aspect ratio (18∶1) TSVs integrated in a micropin-fin heat sink capable of removing power density of 100W/cm2 and resulting in junction temperatures below 50 °C.
Cooling is a significant challenge for high-performance high-power 3D ICs. hi this paper, we describe the experimental evaluation of 3D ICs with embedded microfluidic cooling. Different architectures are experimentally evaluated ine hiding: 1) a memory-on-processor stack. 2) a processor-on-processor stack with equal power dissipation, and 3) a processor-on-processor stack with different power dissipation,...
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