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The atom diffusion and growth behavior of intermetallic compound (IMC) at Sn3.5Ag0.5Cu/Cu interfaces under isothermal aging and thermal-shearing cycling conditions were investigated. The results show that the morphology of Cu6Sn5 IMCs formed at Sn3.5Ag0.5Cu/Cu interface changed gradually from scallop-like to chunk-like, and IMCs thickness developed with the isothermal aging and thermal-shearing cycling...
The changes of morphology and growth tropism of inter-metallic compound (IMC) and IMC growth rate at lead-free solders/Cu interface of solder joints often limit the reliability of the entire package during service. Furthermore, during thermal-shearing cycling process, the thickness of IMC at the interface grows significantly and growth tropism of IMC changes, resulting in in-service evolution of the...
The creep response of solder joints in a microelectronic package, which are subjected to aggressive thermal-shearing cycling during service, often limits the reliability of the entire package. Furthermore, during cycle, the microstructures of the new lead-free solders (Sn-Ag-Cu) can undergo significant in strain-enhanced coarsening, resulting in in-service evolution of the creep behavior. In this...
In this paper, the atom diffusion and growth behavior of intermetallic compound (IMC) and fracture forming mechanism at Sn-Ag-Cu/Cu interfaces under thermal-shearing cycling were investigated. Shear-stress is beneficial to atoms' diffusion and IMC growth, therefore, the results show that there is only one kind of IMC, Cu6 Sn5, forms at Sn-Ag-Cu/Cu interface after thermal-shearing cycling 720 cycles...
The diffusion of the atoms and growth behavior of intermetallic compounds (IMCs) at Sn-3.5Ag-0.5Cu/Cu interfaces under the isothermal aging and thermal-shearing cycling condition were investigated. The results show that there is a Cu6Sn5 IMC layer formed at Sn-Ag-Cu/Cu interface, and the morphology of the Cu6Sn5 changes from scallop-type microstructure to planar-type one with the thermal-shearing...
In this work, microstructure and intermetallic growth at the Sn-Ag-Cu/Ni interface were researched under the thermal-shearing cycling condition varying from 25 degC to 125 degC. The results show that two kinds of intermetallic compounds, identified as (NixCu 1-x)Sn3 and (CuxN1-x)6 Sn5, were found at the interface between Sn-3.5Ag-0.5Cu and Ni after thermal-shearing cycling. The (CuxN1-x)6Sn5 IMC grows...
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