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The atom diffusion and growth behavior of intermetallic compound (IMC) at Sn3.5Ag0.5Cu/Cu interfaces under isothermal aging and thermal-shearing cycling conditions were investigated. The results show that the morphology of Cu6Sn5 IMCs formed at Sn3.5Ag0.5Cu/Cu interface changed gradually from scallop-like to chunk-like, and IMCs thickness developed with the isothermal aging and thermal-shearing cycling...
The diffusion of the atoms and growth behavior of intermetallic compounds (IMCs) at Sn-3.5Ag-0.5Cu/Cu interfaces under the isothermal aging and thermal-shearing cycling condition were investigated. The results show that there is a Cu6Sn5 IMC layer formed at Sn-Ag-Cu/Cu interface, and the morphology of the Cu6Sn5 changes from scallop-type microstructure to planar-type one with the thermal-shearing...
In this work, microstructure and intermetallic growth at the Sn-Ag-Cu/Ni interface were researched under the thermal-shearing cycling condition varying from 25 degC to 125 degC. The results show that two kinds of intermetallic compounds, identified as (NixCu 1-x)Sn3 and (CuxN1-x)6 Sn5, were found at the interface between Sn-3.5Ag-0.5Cu and Ni after thermal-shearing cycling. The (CuxN1-x)6Sn5 IMC grows...
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