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The sealing process of packer rubbers is analyzed by finite element methods with the ANSYS software in the paper. It introduces in detail the principles of the packer's sealing, elaborates the elementary theories of the finite element analysis and the methods to determine the model parameters, establishes the finite element analysis models of the packer rubbers, analyzes the relationship between the...
Multi-physics characterization of multi-layered stacked through silicon vias (TSVs) is performed based on the hybrid time-domain finite element method (FEM), with most temperature-dependent material parameters treated appropriately. Using our developed algorithm, numerical computation is carried out so as to capture transient electro-thermo-mechanical responses of different TSV geometries injected...
With the rapid development of electronic technology, semiconductor section resistivity measurement is receiving increasing attention. This paper applies electrical impedance tomography (EIT) technology to semiconductor resistivity measurements. FEM is applied to solve the EIT forward problem. Mathematical description of partial differential equation, equivalent variation differential problem, element...
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